?W@^?I? 9 ? 7 ? 1 silicon touch technology inc . 9-7f-1, prosperity road i, science based industrial park, hsin-chu, taiwan 300, r.o.c. tel 886-3-5645656 fax 886-3-5645626 PS252C version : a.001 issue date : 2009/03/13 file name : sp-PS252C-a.001.doc total pages : 10 2-channel secondary monitoring ic
c???? silicon touch technology inc. 2-channel secondary monitoring ic version a.001 - 1 - ps252 c PS252C 2-channel secondary monitoring ic general description PS252C is specially designed for switchi ng power supply system. four important functions of PS252C are the followings: over-v oltage protection, over-current protection, under-voltage protection and power good signal generating. ovp/uvp (over-voltage/under-voltage protec tion) monitors dual 12v to protect our power supply and pc, fpo/ goes to high when one of these supply voltages exceeds their normal oper ation voltage range. ocp (over current protection) monitors is12a, is12b input current sense. an adjustable over-current condition composed of iref and ?protect ion current range resistor? helps users design ocp easily. an additional protection input pin provides the flexibility for design protection circuit. power good signal generating notifies personal computer when power supply is ready or power supply is going to shutdown, therefore it can provide a reliable power supply environment. features ? over/under-voltage protection and lock out ? over-current protection and lock out ? additional protection input ? fault protection output with open drain output stage ? open drain power good output signal for power good input ? built-in 300ms power good delay ? ac on 75ms delay for uv/oc protection ? 38ms pson/ control de-bounce ? wide power supply range (3.8v~16v) ? special care for ac power off
c???? silicon touch technology inc. 2-channel secondary monitoring ic version a.001 - 2 - ps252 c block diagram vs12b r1 r2 r3 v re f v re f 12 ov 12 uv band-gap reference power on reset clock generator 38ms de-bounce constant current source i ref fpo/ pgi pgo ri gnd por v ref clk 73us de-bounce h : 300ms l : 4.5us delay 1m h : 75ms l : 4.5us delay 1.25v vcci s q r 1m h : 4ms l : 4.5us delay vs12a 12 ov 12 uv r1 r2 r3 v re f v re f 1.2v pext internal power vcci = 4v h : 20ms l : 4.5us delay is12a i ref x 8 12 oc vcci step down to near 2.5v is12b i ref x 8 12 oc vcci step down to near 2.5v 1.25v 53us delay vcc vcc 53us delay 22us delay pgi selection pson/ vcc 30k vref vcci 90k 4.5v 2k
c???? silicon touch technology inc. 2-channel secondary monitoring ic version a.001 - 3 - ps252 c timing chart t d1 t b1 t d3 t d2 fpo/ pson/ pgi vcc pgo uvp/ovp/ocp pext protect pson/ turn on ac turn on pson/ turn off pson/ turn on ac turn off is12a vs12b is12b pext vs12a v pgi t d2 t d1 1.25v 1.25v ovp ovp/uvp/ocp/pext ovp
c???? silicon touch technology inc. 2-channel secondary monitoring ic version a.001 - 4 - ps252 c pin descriptions pin no pin name descriptions 1 pgi power good input signal pin 2 gnd ground 3 fpo/ inverted fault protection output ,open drain output stage 4 pson/ remote on/off control input pin 5 ri current sense setting 6 is12b 12v(2) over curr ent protection input pin 7 vs12b 12v(2) over/under voltage protection input pin 8 pext external protection detect input pin 9 is12a 12v(1) over curr ent protection input pin 10 vs12a 12v(1) over/under voltage protection input pin 11 none 12 none 13 vcc power supply 14 pgo power good output signal pin , open drain output stage absolute maximum ratings parameter rating unit s torage temperature (t stg ) -40 to +125 c o perating temperature (t opr ) -30 to +90 c s upply voltage (v cc ) vcc -0.5 to +16.0 v vs12a, vs12b, is12a,is12b -0.5 to +16.0 v pext -0.5 to +7.0 v pgi -0.5 to +16.0 v input voltage range (v i ) pson/ -0.5 to vcc+0.5 v fpo/ -0.5 to vcc+0.5 v o utput voltage range (v o ) pgo -0.5 to vcc+0.5 v o utput current for ri (i ri ) ri 12.5 to 62.5 ua esd susceptibility* (v esd ) > 2000 v * human body model (hbm).
c???? silicon touch technology inc. 2-channel secondary monitoring ic version a.001 - 5 - ps252 c electrical characteristics , vcc=12v, t a = 25c. (unless otherwise specified) power supply section parameter conditions min typ max unit supply voltage 3.8 5.0 16.0 v supply current v pson/ = 5v 4.5 5.0 ma power on reset threshold voltage (v por ) 3.2 3.4 3.6 v power on reset hysteresis (v hyst ) -0.15 -0.3 -0.45 v over-voltage section parameter conditions min typ max unit vs12a/b over-voltage threshold 13.3 13.8 14.2 v under-voltage section parameter conditions min typ max unit vs12a/b under-voltage threshold 9.8 10.2 10.6 v pson/, analog input parameter conditions min typ max unit threshold voltage ( high ) 1.60 v threshold voltage ( low ) 0.75 v pgi, analog input parameter conditions min typ max unit threshold voltage for start t d1 1.16 1.25 1.33 v threshold voltage for mask uv, oc 1.16 1.25 1.33 v hysteresis (v hyst )* +/-20 +/-50 +/-80 mv * all of the comparator for pgi input in block diagram.
c???? silicon touch technology inc. 2-channel secondary monitoring ic version a.001 - 6 - ps252 c electrical characteristics (continued) pgo, open drain digital output parameter conditions min typ max unit leakage current (i lkg ) v pgo =5v 5 ua low level output voltage (v ol ) i sink =10ma 0.3 v over-current section parameter conditions min typ max unit vs12a/b offset voltage -5 0 5 mv constant isink current (i sink ) 144 160 172 ua fpo/, open drain digital output parameter conditions min typ max unit leakage current (i lkg ) v fpo/ =5v 5 ua low level output voltage (v ol ) i sink =20ma 0.4 v external protection detect section parameter conditions min typ max unit threshold(v th ) 1.15 1.20 1.25 v hysteresis (v hyst ) +/-20 +/-50 +/-80 mv switching characteristics , vcc=12v, t a = 25c. parameter conditions min typ max unit pgi to pgo delay time (t d1 ) 200 300 400 ms short circuit delay time (t d2 ) pgi>1.25v 49 75 114 ms short circuit delay time (t d2-1 ) pgi<1.25v 400 500 600 ms pgo to fpo/ delay time (t d3 ) 2 4 6 ms under voltage delay time (t d4 ) 47 73 110 us over current delay time (t d5 ) 13 20 27 ms over voltage delay time (t d6 ) 15 22 30 us pext delay time (t d7 ) 47 73 110 us pson/ de-bounce time (t b1 ) 24 38 61 ms pgo noise de-glitch time (t b2 ) 47 73 100 us
c???? silicon touch technology inc. 2-channel secondary monitoring ic version a.001 - 7 - ps252 c application typical 2 rails sps 14 13 12 11 10 9 8 1 2 3 4 5 6 7 pgi pson/ ri is12b vs12 b is12 a fpo/ gnd pgo none pext vs12a none vcc r r r i r pgi-2 c pgi-2 1k +5v sb pgo pson +5v sb s.p.s. secondary side r s 12 b +12vb output +12vb coil 12 a +12va output +12va coil r s r pgo 4.7k c pgo r oc12b 0.1 uf c pgi-1 r pgi-1 c by vdet 0.1 u f c 12a-2 0.1 u f c 12b-2 0.1 u f c 12a - 1 c 12b-1 oc12a pext 0.1 u f c ps o 0.1 u f n notes: 1. zener diode or resist or or both of t hem can be used in component x. 2. the bypass capacitor c by suggests to be 0.1uf~ 10uf and layout nearby pin vcc. 3. the recommend sense values of r s12a , r s12b are 0.002 . 4. over-current protection design example: (1) a i ref 20 = , () = = = k i v r ri ri i 5 . 62 20 25 . 1 (2) r s5 =0.002 , ref oc v v i r i v = = + 8 002 . 0 5 5 5 (3) if 12v ocp trip point is 20a, () = = 250 20 8 20 002 . 0 5 oc r
c???? silicon touch technology inc. 2-channel secondary monitoring ic version a.001 - 8 - ps252 c package specification d e 1 e b 1 a 1 e a s a 2 ? 0.0 0.5 1.0 inch 0 10 25 mm 15 5 20 ( 14-pin dip ) l seating plane b e b dimension in mm symbol dimension in inch note a 1 0.381 0.015 a 2 3.175 3.302 3.429 0.125 0.13 0.135 b 1 0.400 0.480 0.560 0.015 0.019 d 18.669 19.495 20.320 0.735 0.768 0.800 e 1 6.223 6.812 7.400 0.245 0.268 0.291 e 2.290 2.540 2.790 0.090 0.100 0.110 l 2.540 3.175 3.810 0.100 0.125 0.150 s 2.390 0.094 a 5.334 0.210 e 7.366 7.620 7.874 0.290 0.300 0.310 e b 8.509 9.017 9.525 0.335 0.355 0.375 b 1.300 1.500 1.700 0.051 0.059 0.067 ? 0 7 15 0 7 15 min normal max min normal max
c???? silicon touch technology inc. 2-channel secondary monitoring ic version a.001 - 9 - ps252 c the products listed herein are designed for or dinary electronic applications, such as electrical appliances, audio-visual equi pment, communications devices and so on. hence, it is advisable that the devices should not be used in medical instruments, surgical implants, aerospace machi nery, nuclear power control systems, disaster/crime-prevention equipment and the like. misusing those products may directly or indirectly endanger human lif e, or cause injury and property loss. silicon touch technology, inc. will not take any responsibilities regarding the misusage of the products m entioned above. anyone w ho purchases any products described herein with the above-mentioned intention or with such misused applications should accept full responsibility and indemnify. silicon touch technology, inc. and its distributors and all their office rs and employees shall defend jointly and severally against any and all claims and litigation and all damages, cost and expenses associated with such in tention and manipulation. silicon touch technology, inc. reserve the ri ght to make changes to their products or to discontinue any product or service without notice, and advise cu stomers to obtain the latest version of relevant informati on to verify, before placing orders, that information being relied on is current and complete.
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